May 04, 2024

Research on Key Technologies of High-Performance Alloy Conductive Materials and Their Fine Materials Processing



Significant progress was made in the project of strategic advanced electronic materials key project "Research and construction of demonstration bases for key technologies of high-performance alloy conductive materials and their fine materials processing"
Recently, experts from the High-tech Center of the Ministry of Science and Technology organized an on-site mid-term inspection of the key special project "Research and Construction of Demonstration Bases for the Processing of High-Performance Alloy Conductive Materials and Fine Materials" of the National Strategic Research and Development Program "Strategic Advanced Electronic Materials" . The expert group listened to the project team's work report, watched the production of prototypes and demonstration bases on site, and affirmed the progress of the project and the application of R & D results.
The project is mainly aimed at the demand of electronic devices and integrated circuits for conductive alloy wire and foil materials, research on the micro-alloying and softening mechanism of ultra-pure copper alloys, research and development of ultra-pure copper-silver alloy wire foils, fine gold-silver bonding wires, and nickel-chromium precision The series of resistance alloy foil products realize large-scale production of ultra-pure copper-silver alloy materials. Up to now, the project has achieved trial production of 90μm copper-silver alloy wire / foil by controlling the amount of cold working deformation and heat treatment; the batch-optimized continuous casting process has produced gold-silver alloy rods with excellent microstructure and performance. 25μm series of gold and silver bonding wire materials were prepared by die and XY alternate drawing method, and the preparation of gold and silver multi-layer bonding wires was realized by cyanide-free electroplating process; 20μm nickel-chromium G alloy foil material was developed and the prepared material was developed A batch trial has been implemented.

Silicon Nitride is used as a high-grade refractory material, such as SI3N4-SIC refractory material for blast furnace body and so on with sic junction; for example, SI3N4-BN material is used in combination with BN for horizontal continuous casting separation ring. The SI3N4-BN horizontal continuous casting separation ring is a fine structure ceramic material with uniform structure and high mechanical strength. It has good thermal shock resistance and is not wetted by molten steel, which meets the requirements of continuous casting process.


Silicon Nitride Ceramic Structural Parts

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